Chinese memory maker CXMT could add more than 100,000 DRAM wafers per month within a year, lifting capacity from about 320,000 to 420,000 units, according to forecasts from Counterpoint Research and TrendForce, reported by Wccftech. For 2028 the range is 500,000 to 600,000 wafers per month, roughly 87.5% above today.
The expansion targets general-purpose DRAM, the standard chips used in PCs, smartphones and other consumer devices. Over recent months the large Korean and American makers have concentrated resources on HBM, high-bandwidth memory for AI accelerators, which is more profitable and harder to make. The result is a shortage of conventional DRAM that has pushed prices up and hit consumer electronics.
In this picture CXMT can play a major role. The forecasts indicate most of the new volume will go to the Chinese market and that prices are not yet clearly competitive, so the benefit for Western consumers may remain limited. The same analyses show the sharpest increase arriving only after 2027, with new lines in Beijing, Shanghai and Hefei.
On the customer side, reports say Apple is interested in buying CXMT chips for products sold in China, but talks are reportedly stalled: the maker has turned down the iPhone group's request for a discount, offering prices similar to or above Samsung's.
The key point is that the coming capacity serves demand from mass-market devices, not competition in HBM, where CXMT remains behind.
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